Board inspection method

摘要

In order to inspect a board, first, an inspection area including a solder joint is provided with a first light having a first color, a second light having a second color and a third light having a third color at a first inclination angle, a second inclination angle smaller than the first inclination angle and a third inclination angle smaller than the second inclination angle with respect to the board, respectively. Then, a color image of the inspection area is acquired according to the first light, the second light and the third light provided to the inspection area. Thereafter, it is inspected whether the solder joint is good or bad by using a color distribution in the color image. Then, the inspection result is verified by using pre-measured height information of the solder joint. Thus, an inspection error may be prevented.

主权项

1. A board inspection method comprising:
providing an inspection area including a solder joint of a component mounted on a board with a first light having a first color, a second light having a second color different from the first color and a third light having a third color different from the first and second colors at a first inclination angle with respect to the board, a second inclination angle smaller than the first inclination angle with respect to the board and a third inclination angle smaller than the second inclination angle with respect to the board, respectively; acquiring a color image of the inspection area according to the first light, the second light and the third light provided to the inspection area; inspecting whether the solder joint is good or bad by using a color distribution in the color image; and verifying the inspection result by using pre-measured height information of the solder joint.