Probe card for testing a semiconductor chip

摘要

There is provided a probe card comprising a plurality of probe tips, each being ball-shaped or pillar-shaped and having a top end in contact with each of target chip pads to be tested; a first space converting unit; a second space converting unit; a frame configured to support the second space converting unit; an interposer unit; and a circuit board.

主权项

1. A probe card comprising:
a plurality of probe tips, each being ball-shaped or pillar-shaped and having a top end in contact with each of target chip pads to be tested; a first space converting unit configured to have first wirings formed on a top surface thereof to be electrically connected to a bottom end of each of the probe tips and second wirings formed in multi-layers to be electrically connected to the wirings formed on the top surface; a second space converting unit configured to have third wirings formed on a top surface thereof to be electrically connected to the second wirings in multi-layers of the first space converting unit and pads disposed on a bottom surface that are electrically connected to the third wirings; a frame configured to support the second space converting unit; an interposer unit configured to comprise interposers being located in holes formed in the frame to support the second space converting unit, being electrically connected to the pads of the second space converting unit and providing elasticity; and a circuit board configured to support the interposer unit and transmit a test signal to the interposers that are electrically connected to the circuit board, wherein the second space converting unit is configured to be formed of a silicon wafer and have a plurality of via-holes to electrically connect the third wirings and the pads disposed on the bottom surface of the second space converting unit.