| 发明名称 | MEMS device and method of forming the same | ||
| 摘要 | A method for forming a MEMS device is provided. The method includes the following operations of providing a substrate having a first portion and a second portion; fabricating a membrane type sensor on the first portion of the substrate using a double-side process; and fabricating a bulk silicon sensor on the second portion of the substrate. | ||
| 申请公布号 | US8900905(B1) | 申请公布日期 | 2014.12.02 |
| 申请号 | US201313957491 | 申请日期 | 2013.08.02 |
| 申请人 | Taiwan Semiconductor Manufacturing Company Limited | 发明人 | Liu Yu-Chia;Chu Chia-Hua;Peng Jung-Huei;Chang Kuei-Sung;Cheng Chun-Wen |
| 分类号 | H01L21/00;H01L29/84 | 主分类号 | H01L21/00 |
| 代理机构 | Jones Day | 代理人 | Jones Day |
| 主权项 | 1. A microelectromechanical system (MEMS) device, comprising: a substrate having a first portion and a second portion; a membrane type sensor disposed on the first portion of the substrate and formed by a double-side process; and a bulk silicon sensor disposed on the second portion of the substrate, wherein the membrane type sensor further comprises: a silicon layer; a reference element configured as an electrode of the membrane type sensor; and a substantially sealed cavity disposed between the silicon layer and the reference element. | ||
| 地址 | Hsinchu TW | ||