EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF

摘要

An embedded substrate of the present invention may include an electronic device, a dielectric layer formed in a shape of embedding the electronic device, a first circuit pattern formed in a shape of being embedded in the lower part of the dielectric layer and allowing conducive material to adhere and bond the electronic device and a device pad through a connection pad, and a solder mask layer which electrically connects the first circuit pattern and a second circuit pattern embedded in an upper part through a via hole, fills the via hole and selectively protects or exposes parts of the first and the second circuit pattern at the same time.