| 摘要 |
<p>The present invention relates to an electroless plating method. According to the present invention, silver cyanide is used instead of silver nitrate. Therefore, stability of a silver plating solution and the plating thickness are increased; at the same time, the silver plating solution for electroless plating which is used and stored in an easy manner can be provided. The silver plating solution includes silver liquid and a reducing solution. The silver liquid includes sodium cyanide and sodium hydroxide. The reducing solution includes one or more selected from a group consisting of sodium borohydride, dimethylamine borane, and hydrazine sulfate.</p> |
