| 摘要 |
<p>PROBLEM TO BE SOLVED: To inhibit deterioration due to a bending stress at a connection part between a conductor pattern and a via conductor in a resin multilayer substrate.SOLUTION: A resin multilayer substrate 101 comprises a laminate in which a plurality of resin layers 2 are laminated. The laminate includes: a first via conductor 6a which pierces a first resin layer 2a in a thickness direction to be connected to a conductor pattern 7; and a second via conductor 6b which pierces a second resin layer 2b in a thickness direction to be connected to the conductor pattern 7. When viewed in a planar and perspective manner and regions connected to the conductor pattern 7 of the first via conductor 6a and the second via conductor 6b which are located on inner peripheral side/outer peripheral side when the laminate is bent are referred to as inner peripheral side connection region 51/outer peripheral side connection region 52, respectively, the inner peripheral side connection region 51 overlaps the outer peripheral side connection region 52 so as to include the outer peripheral side connection region 52 or the inner peripheral side connection region 51 and the outer peripheral side connection region 52 overlap each other so as to coincide with each other.</p> |
