DEVELOPING METHOD FOR DEVELOPING APPARATUS

摘要

A developing method including a developing step in which, while a wafer horizontally held by a spin chuck is being rotated, the wafer is developed by supplying a developer onto a surface of the wafer, wherein provided before the developing step is a pre-wetting step in which, simultaneously with the developer being supplied from a first nozzle that is located on a position near a central part of the surface of the rotating wafer, a deionized water as a second liquid is supplied from a second nozzle that is located on a position nearer to an outer peripheral part of the wafer than the first nozzle, to thereby spread out the developer in the rotating direction of the wafer by a wall that is formed by the deionized water flowing to the outer peripheral side of the wafer with the rotation of the wafer.

主权项

1. A developing apparatus configured to rotate a horizontally held substrate, and to develop the substrate by supplying a developer onto a surface of the substrate, the developing apparatus comprising:
a substrate holding means configured to horizontally hold the substrate; a rotating mechanism configured to rotate the substrate in a horizontal plane; a first nozzle configured to supply the developer onto the substrate surface, while the substrate is being rotated by the rotating mechanism; a second nozzle configured to supply a second liquid onto the substrate surface, the second nozzle being located on a position nearer to an outer peripheral part of the substrate than the first nozzle; and a control means configured to control the rotating mechanism, the first nozzle, and the second nozzle; wherein, before a developing step in which the developer is supplied to the substrate, the control means drives the rotating mechanism so as to rotate the substrate, and performs a pre-wetting process in which, simultaneously with the developer being supplied from the first nozzle that is located on a position near a central part of the surface of the substrate, the second liquid is supplied from the second nozzle that is located on a position nearer to the outer peripheral part of the substrate than the first nozzle, to thereby spread out the developer in the rotating direction of the substrate by a wall that is formed by the second liquid flowing the outer peripheral side of the substrate with the rotation of the substrate.