发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide an SiC semiconductor device capable of increasing the channel mobility without introducing excessive fixed charges into the interface between an SiC layer and a gate insulating film.SOLUTION: The semiconductor device includes: an SiC semiconductor layer 111; and a gate insulating film 117 and a gate electrode 116 formed in order at the side where a first ohmic electrode 113 of the SiC semiconductor layer 111 is provided. The SiC semiconductor layer 111 is formed in contact with the gate insulating film 117 and has a group V element containing region 137 including a group V element. The concentration peak of the group V element in the group V element containing region 137 is located within 5 nm from the interface with the gate insulating film 117. The concentration of carbon in the gate insulating film 117 is 1 atom% or less.</p> |
申请公布号 |
JP2014222734(A) |
申请公布日期 |
2014.11.27 |
申请号 |
JP20130102394 |
申请日期 |
2013.05.14 |
申请人 |
PANASONIC CORP |
发明人 |
KAGAWA KAZUHIRO;KIYOSAWA TSUTOMU;TANAKA KOTARO;TOMITA YUKI;YANASE YASUYUKI |
分类号 |
H01L29/78;H01L21/336;H01L29/12 |
主分类号 |
H01L29/78 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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