MULTI-LAYER BARRIER ADHESIVE FILM

摘要

A multi-layer barrier adhesive is used for the encapsulation of electronic devices, such as organic light-emitting diodes (OLEDs), photovoltaics, and thin-film transistors. The multi-layer adhesive comprises at least one barrier layer disposed adjacent at least one adhesive layer. In one embodiment the barrier layer is a fluoropolymer. The fluoropolymer is preferably a homopolymer of tetrafluoroethylene (PTFE) or chlorotrifluoroethylene (PCTFE), or their copolymers.