| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component capable of performing ohmic contact between conductive layers forming a pad.SOLUTION: An electronic component includes a pad p. The pad includes: a lower layer transparent conductive layer 15a; an insulation layer 18b provided on the lower layer transparent conductive layer 15a; a contact hole 18c formed on the insulation layer 18b to expose the lower layer transparent conductive layer 15a; a metal layer 19 provided on the lower layer transparent conductive layer 15a, covered with the insulation layer 18b, and surrounding the contact hole 18c; and an upper layer transparent conductive layer 15b provided on the insulation layer 18b and connected with the lower layer transparent conductive layer 15a through the contact hole 18c. |
