发明名称 |
FIELD-EFFECT SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
<p>PROBLEM TO BE SOLVED: To improve device characteristics by reducing the contact resistance between a SiGe layer and wiring without causing the occurrence of defect in the SiGe layer in a configuration that provides tensile strain to a Ge channel through the SiGe layer.SOLUTION: A field-effect semiconductor device having a Ge channel and a source-drain region of SiGe includes: a semiconductor layer 10 containing Ge; a gate electrode 31 provided on the semiconductor layer 10 via a gate insulating film 20; a source-drain region 60 provided in the semiconductor layer 10 so as to sandwich a channel region under the gate electrode 31, providing tensile strain to the channel region, and composed of SiGe(0<x<1); a Ge layer 63 formed on the source-drain region 60; and a wiring layer 72 being in contact with the Ge layer 63.</p> |
申请公布号 |
JP2014222723(A) |
申请公布日期 |
2014.11.27 |
申请号 |
JP20130102017 |
申请日期 |
2013.05.14 |
申请人 |
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL & TECHNOLOGY |
发明人 |
KAMIMUTA YUICHI;MORIYAMA YOSHIHIKO |
分类号 |
H01L21/336;H01L21/28;H01L21/768;H01L23/522;H01L29/417;H01L29/78 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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