发明名称 FIELD-EFFECT SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To improve device characteristics by reducing the contact resistance between a SiGe layer and wiring without causing the occurrence of defect in the SiGe layer in a configuration that provides tensile strain to a Ge channel through the SiGe layer.SOLUTION: A field-effect semiconductor device having a Ge channel and a source-drain region of SiGe includes: a semiconductor layer 10 containing Ge; a gate electrode 31 provided on the semiconductor layer 10 via a gate insulating film 20; a source-drain region 60 provided in the semiconductor layer 10 so as to sandwich a channel region under the gate electrode 31, providing tensile strain to the channel region, and composed of SiGe(0<x<1); a Ge layer 63 formed on the source-drain region 60; and a wiring layer 72 being in contact with the Ge layer 63.</p>
申请公布号 JP2014222723(A) 申请公布日期 2014.11.27
申请号 JP20130102017 申请日期 2013.05.14
申请人 NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL & TECHNOLOGY 发明人 KAMIMUTA YUICHI;MORIYAMA YOSHIHIKO
分类号 H01L21/336;H01L21/28;H01L21/768;H01L23/522;H01L29/417;H01L29/78 主分类号 H01L21/336
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