METHOD AND DEVICE FOR PACKAGING SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a method and device for packaging a substrate.SOLUTION: There is provided a package structure 800 and method of packaging an interferometric modulator 830. A thin film material is deposited over the interferometric modulator 830 and a transparent substrate 810 to encapsulate the interferometric modulator 830. A gap or cavity 840 between the interferometric modulator 830 and a thin film 820 provides a space in which mechanical parts of the interferometric modulator 830 may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator 830.