INTEGRATED THIN-FILM OPTRODE

摘要

An optrode may provide a cylindrical substrate two or more electrodes deposited said cylindrical substrate. The cylindrical substrate and electrodes may be coated by an insulating layer with openings or vias over certain portions of the electrodes that may provide a contact for the neural probe or may be utilized to connect lead lines. Manufacturing of an optrode may utilize a jig that secures a cylindrical substrate coated by a conductive material and a resist. A first mask may be positioned in an opening provided by the jig, and the cylindrical substrate may be exposed ions or neutral particles to define one or more electrode patterns. After regions of the resist and conductive material are removed to form the electrodes, a second mask may be utilized to define vias regions in which portions of the electrodes are exposed and uncoated by an insulating layer.

主权项

1. A method for fabricating a probe, the method comprising:
positioning at least one cylindrical substrate in a first jig, wherein the at least one cylindrical substrate is coated by an electrode layer and a resist layer, and the jig comprises at least one v-groove for receiving the cylindrical substrate and a first stencil mask defining a first pattern for contact lines and electrode sites; exposing said at least one cylindrical substrate to a first broad beam of energetic ions or neutral particles, wherein said first broad beam transfers said first pattern to the resist on the at least one cylindrical substrate; removing a portion of the resist from the at least one cylindrical substrate, wherein remaining resist corresponding to the first pattern is unremoved from the at least one cylindrical substrate; removing exposed portion of the electrode layer from the at least one cylindrical substrate, wherein the remaining resist left on the cylindrical substrate prevents a portion of said electrode layer below the remaining resist from being removed, thereby forming the contact lines and the electrode sites from the electrode layer; and removing the remaining resist from the at least one cylindrical substrate, wherein removing the remaining resist uncovers the contact lines and the electrode sites.