| 发明名称 |
UV-CURABLE THERMOFORMABLE DIELECTRIC FOR THERMOFORMABLE CIRCUITS |
| 摘要 |
This invention is directed to a polymer thick film UV-curable thermoformable dielectric composition. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive thermoformable silver and the polycarbonate substrate below in capacitive switch applications. |
| 申请公布号 |
US2014350161(A1) |
申请公布日期 |
2014.11.27 |
| 申请号 |
US201313899738 |
申请日期 |
2013.05.22 |
| 申请人 |
E I DU PONT DE NEMOURS AND COMPANY |
发明人 |
DORFMAN JAY ROBERT |
| 分类号 |
H01B3/44;H01B3/30 |
主分类号 |
H01B3/44 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A polymer thick film UV-curable thermoformable dielectric composition comprising:
(a) 20-60 wt % acrylated urethane oligomer with a percent elongation of at least 100%; (b) 5-30 wt % alkyl acrylate monomer; (c) 1-15 wt % acrylated amine; and (d) 5-35 wt % inorganic powder;wherein the wt % are based on the total weight of the polymer thick film UV-curable thermoformable dielectric composition. |
| 地址 |
Wilmington DE US |
