发明名称 DISASSEMBLY MECHANISM FOR RAPIDLY DISASSEMBLING AN EXPANSION CARD
摘要 The present invention discloses a disassembly mechanism including a plate, at least one guiding component, at least one constraining component and a pushing component. The plate is installed on a circuit board of an electronic device, at least one opening and a slot are formed on the plate. The slot sheathes a socket on the circuit board. The at least one guiding component is for guiding the plate to move in a guiding direction. The at least one constraining component is disposed on the at least one guiding component for constraining movement of the plate in the guiding direction. The pushing component is connected to the plate and is for moving with the plate synchronously, so as to push the expansion card to separate from the socket.
申请公布号 US2014347808(A1) 申请公布日期 2014.11.27
申请号 US201314133561 申请日期 2013.12.18
申请人 Wistron Corporation 发明人 Hong Wei-Ling
分类号 G06F1/18;H05K7/14 主分类号 G06F1/18
代理机构 代理人
主权项 1. A disassembly mechanism for rapidly disassembling an expansion card, the disassembly mechanism comprising: a plate installed on a circuit board of an electronic device, at least one opening and a slot being formed on the plate, and the slot sheathing a socket on the circuit board; at least one guiding component inserted into the at least one opening, the at least one guiding component being for guiding the plate to move in a guiding direction; at least one constraining component disposed on the at least one guiding components, the at least one constraining component being for constraining movement of the plate in the guiding direction; and a pushing component connected to the plate, the pushing component moving with the plate synchronously as the plate moves in the guiding direction, so as to push the expansion card to separate from the socket.
地址 New Taipei City TW