A copper oxide/silicon dioxide composite in spherical and/or spheroid form with an average particle diameter of 10 to 500 nm, containing 5 to 90% by weight silicon dioxide and 10 to 95% by weight copper oxide, wherein the composite particles are core-shell particles with amorphous silicon dioxide forming the shell and copper oxide forming the core, and wherein the copper oxide contains Cu2O, CuO or a mixture thereof.
申请公布号
WO2014187646(A1)
申请公布日期
2014.11.27
申请号
WO2014EP58564
申请日期
2014.04.28
申请人
EVONIK INDUSTRIES AG;KATUSIC, STIPAN;KRESS, PETER;ALFF, HARALD;RENGER, TOBIAS;HAGEMANN, MICHAEL
发明人
KATUSIC, STIPAN;KRESS, PETER;ALFF, HARALD;RENGER, TOBIAS;HAGEMANN, MICHAEL