| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for removing an interconnection layer between a carrier and a wafer that form a carrier/wafer assembly.SOLUTION: The device includes: rotation means for rotating a carrier/wafer assembly 21; and connection part removal means for providing an immersion tank for accommodating the carrier/wafer assembly. The connection part removal means includes: an operating chamber 28 in which at least part of circumferential part of the carrier/wafer assembly is accommodated; and means for delivering a solvent that dissolves an interconnection layer at the circumferential part of the carrier/wafer assembly to the operating chamber. |
