| 发明名称 |
ELECTRONIC PART, ELECTRONIC APPARATUS, AND MOVING OBJECT |
| 摘要 |
An electronic part includes amount substrate, a circuit substrate, a pad disposed on the circuit substrate, a bump that connects the mount substrate and the pad to each other, and a surface protection film that extends from a surface of the pad via an outer circumferential edge of the pad to a surface of the circuit substrate and has at least two openings adjacent to each other on the pad. The length equal to one-half the shortest distance from an end of one of the adjacent openings to an end of the other opening is smaller than the length of the shortest distance from the outer circumferential edge of the pad to the end of each of the openings, and the bump is provided in each of the two openings and layered on the surface protection film in a plan view. |
| 申请公布号 |
US2014345928(A1) |
申请公布日期 |
2014.11.27 |
| 申请号 |
US201414285021 |
申请日期 |
2014.05.22 |
| 申请人 |
Seiko Epson Corporation |
发明人 |
KOYAMA Yugo |
| 分类号 |
H05K1/02;H05K1/18;H05K1/11 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic part comprising:
a mount substrate; a circuit substrate; a pad disposed on the circuit substrate; a bump that connects the mount substrate and the pad to each other; and a surface protection film that extends from a surface of the pad via an outer circumferential edge of the pad to a surface of the circuit substrate and has at least two openings adjacent to each other on the pad, wherein the length equal to one-half the shortest distance from an end of one of the adjacent openings to an end of the other opening is smaller than the shortest distance from the outer circumferential edge of the pad to the end of each of the openings, and the bump is provided in each of the two openings and layered on the surface protection film in a plan view. |
| 地址 |
Tokyo JP |
