发明名称 CIRCUIT BOARD AND METHOD FOR FABRICATING THE SAME
摘要 A circuit board and a method for fabricating the same are provided. The circuit board comprises: an aluminum-based substrate; an alumina layer formed on at least one surface of the aluminum-based substrate; and a circuit layer formed on the alumina layer. The alumina layer comprises alumina and an element selected from a group consisting of chromium, nickel, a rare earth metal, and a combination thereof.
申请公布号 WO2014187330(A1) 申请公布日期 2014.11.27
申请号 WO2014CN78066 申请日期 2014.05.21
申请人 SHENZHEN BYD AUTO R&D COMPANY LIMITED;BYD COMPANY LIMITED 发明人 XU, QIANG;LIN, XINPING
分类号 H05K1/03 主分类号 H05K1/03
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