| 摘要 |
FIELD: radio engineering, communication.SUBSTANCE: method is carried out by forming and depositing additional micro-bridges into micro-paths, which improves the quality and reliability of multilayer printed-circuit boards, and also reduces labour input and costs on repurchasing electronic components and remanufacturing multilayer printed-circuit boards.EFFECT: high quality and reliability by enabling correction of defects in multilayer printed circuit board assemblies with highly integrated hardware components using microelectronic techniques.5 cl, 1 dwg |
