| 摘要 |
The invention provides a method for processing a wafer by inserting the wafer into a holding hole of a carrier to hold the wafer, and interposing the carrier holding the wafer between an upper turn table and a lower turn table to process both surfaces of the wafer simultaneously, including: before processing the wafer, detecting a height position of the upper turn table by a laser displacement sensor while interposing the carrier holding the wafer between the upper turn table and the lower turn table; and determining that the wafer is not normally held to redo the holding of the wafer if a difference between the detected height position and a reference position exceeds a threshold. The method can automatically detect accurately a failure in holding the wafer before processing to prevent the wafer from breaking and eliminate the necessity of operator's inspection using touch to improve operation efficiency. |
