| 摘要 |
PROBLEM TO BE SOLVED: To automatically measure a thickness of each tray and properly control the trays in a plasma processing system including the trays in which substrates are placed to be transferred. SOLUTION: A dry etching device 1 includes a transfer mechanism 15 transferring trays between a tray stock part housing each tray on which a substrate is placed and a plasma processing part 11, a centering mechanism 27 positioning each tray at a predetermined position in an alignment part 14, and a height measurement sensor 37 measuring a height of the predetermined position of the positioned tray. A tray thickness measurement processing part 49 calculates thickness data of the tray from the measured height, and a wear state determination part 51 determines the wear state of the tray based on the thickness data. COPYRIGHT: (C)2012,JPO&INPIT |
