发明名称 パワーモジュール用基板の製造方法および製造装置
摘要 PROBLEM TO BE SOLVED: To provide a method and device for manufacturing a substrate for a power module, capable of improving assembly workability of a ceramic substrate and a metal layer and obtaining a firm bonding. SOLUTION: By repeating a lamination body laminating step, in which a ceramic substrate 2 and metal plates 6 and 7 are laminated on a heat-resistant sheet 20 while being positioned in a surface direction by a guide frame 13 that can move forward and backward in the surface direction, and a heat-resistant sheet mounting step, in which a new heat-resistant sheet 20 is mounted on a laminate body 30 of the ceramic substrate 2 and metal plates 6 and 7, a plurality of the lamination bodies 30 is made to be a laminated state via the heat-resistant sheets 20. During a period from the lamination body laminating step to heat-resistant sheet mounting step, the side edge part of the heat-resistant sheet 20 where the laminate body 30 is mounted is pressed from above. During a period after the heat-resistant sheet mounting step to the next lamination body laminating step, after the heat-resistant sheet 20 at an uppermost stage is made to be a pressed state from above, pressing on the side edge part of the heat-resistant sheet 20 is released and a guide frame 13 is evacuated. COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP5630355(B2) 申请公布日期 2014.11.26
申请号 JP20110069817 申请日期 2011.03.28
申请人 发明人
分类号 H01L23/12;H05K3/38 主分类号 H01L23/12
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