发明名称 |
INSULATION MATERIAL FOR ELECTRONIC DEVICE |
摘要 |
<p>The present invention relates to insulating material for an electronic device that may inhibit damage to electronic devices by a high temperature curing process, and simultaneously contribute to improvement in reliability of electronic devices. The insulating material for an electronic device comprises soluble polyimide resin comprising a specific repeat unit, and a residual solvent comprising a low boiling point solvent having boiling point of 130 to 180°C, wherein after curing at a temperature of 250°C or less, the amount of outgassing is 4 ppm or less based on total weight of the soluble polyimide resin, and the amount of outgassing derived from water or alcohol is less than 0.1 ppm.</p> |
申请公布号 |
EP2806428(A2) |
申请公布日期 |
2014.11.26 |
申请号 |
EP20130735630 |
申请日期 |
2013.01.11 |
申请人 |
LG CHEM, LTD. |
发明人 |
KIM, SANG-WOO;IM, MI-RA;KIM, KYUNG-JUN;PARK, CHAN-HYO;NAM, KYOU-HYUN |
分类号 |
H01B3/38;C08G73/10;C08L79/08 |
主分类号 |
H01B3/38 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|