发明名称 METHOD OF MANUFACTURING PLATING FILMS
摘要 <p>A method of fabricating plating films on a first main surface of a workpiece and a second main surface opposite to the first main surface, respectively, includes the steps of: preparing a periodic reverse current power source and a DC power supply; applying a current periodically changed in the direction thereof at a predetermined timing by power having polarity reversed between the workpiece and a first electrode provided on the first main surface of the workpiece in a plating solution; and applying DC current by the DC power between the workpiece and a second electrode provided on the second surface of the workpiece in the plating solution. The application of the current by the power having the reversed polarity and the application of the DC current by the DC power are simultaneously performed so that the plating films are formed on the first and second main surfaces, respectively.</p>
申请公布号 KR20140135108(A) 申请公布日期 2014.11.25
申请号 KR20140057115 申请日期 2014.05.13
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 KURE MUNEAKI;ARUGA YOSUKE
分类号 C25D5/00;C25D17/10 主分类号 C25D5/00
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