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发明名称
SOLDER ADHESION FORMATION TO HEAD PART SURFACE OF MICRO I/O PIN
摘要
申请公布号
JPH0426089(A)
申请公布日期
1992.01.29
申请号
JP19900127921
申请日期
1990.05.17
申请人
AUGAT INC
发明人
KANZAKI YUJI
分类号
H01R4/02;H01R43/02
主分类号
H01R4/02
代理机构
代理人
主权项
地址
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