| 摘要 |
<p>The present invention provides a power semiconductor power module capable of simplifying a manufacturing process of a power semiconductor module and removing physical stress generated in a forming process and a soldering fault between the power terminal and a substrate by changing the power terminal of a high capacity power semiconductor power module to a cylindrical terminal and a copper washer, and efficiently using the power module and minimizing a fault during a manufacturing process by changing a plate type power terminal having a limit on flow of a high current to the cylindrical power terminal structure. Moreover, when multiple power terminals are embedded in the substrate of the power semiconductor module, the power terminals are embedded in an accurate position and stably embedded, not being separated from the substrate by rotary force coming from the combination of a housing and a bolt.</p> |
