发明名称 |
INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE INTERPOSER SUBSTRATE |
摘要 |
<p>Disclosed is an interposer substrate. The interposer substrate includes a lower plate and an upper plate, an insulating layer which is located between the lower plate and the upper plate and combines the lower plate and the upper plate, and a through electrode which penetrates the lower plate, the insulating layer, and the upper plate.</p> |
申请公布号 |
KR101465361(B1) |
申请公布日期 |
2014.11.25 |
申请号 |
KR20130103971 |
申请日期 |
2013.08.30 |
申请人 |
RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY |
发明人 |
SUH, SU JEONG;PARK, HWA SUN |
分类号 |
H01L23/12 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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