| 发明名称 | Chip identification for organic laminate packaging and methods of manufacture | ||
| 摘要 | A chip identification for organic laminate packaging and methods of manufacture is provided. The method includes forming a material on a wafer which comprises a plurality of chips. The method further includes modifying the material to provide a unique identification for each of the plurality of chips on the wafer. The organic laminate structure includes a chip with a device and a material placed on the chip which is modified to have a unique identification mark for the chip. | ||
| 申请公布号 | US8896138(B2) | 申请公布日期 | 2014.11.25 |
| 申请号 | US201313749744 | 申请日期 | 2013.01.25 |
| 申请人 | International Business Machines Corporation | 发明人 | Banach Albert J.;Daubenspeck Timothy H.;Sauter Wolfgang |
| 分类号 | H01L23/58;H01L23/544;H01L21/56 | 主分类号 | H01L23/58 |
| 代理机构 | Roberts Mlotkowski Safran & Cole, P.C. | 代理人 | Canale Anthony;Roberts Mlotkowski Safran & Cole, P.C. |
| 主权项 | 1. An organic laminate structure comprising a chip with a device and a material placed on the chip which is modified to have a unique identification mark for the chip, wherein the material is metal, and the metal includes an adhesion layer and a cap layer. | ||
| 地址 | Armonk NY US | ||