Conductive paste composition with synthetic clay additive and its use in the manufacture of semiconductor devices

摘要

A conductive paste composition contains a source of an electrically conductive metal, a fusible material, a synthetic clay additive, and an optional etchant additive, dispersed in an organic medium. An article such as a photovoltaic cell is formed by a process having the steps of deposition of the paste composition on a semiconductor substrate by a process such as screen printing and firing the paste to remove the organic medium and sinter the metal and fusible material. The synthetic clay additive aids in establishing a low resistance electrical contact between the front side metallization and underlying semiconductor substrate during firing.

主权项

1. A paste composition comprising in admixture:
a) about 70 to 96% by weight based on solids of electrically conductive silver metal powder; b) about 0.1 to 15% by weight based on solids of a fusible material; c) about 0.1 to 2% by weight based on solids of a nanoscale synthetic clay additive; d) 0 to about 15% by weight based on solids of one or more etchant additives; and e) an organic medium.