发明名称 |
Mechanical layout for half-bridge power module that is optimized for low inductance |
摘要 |
Disclosed is a mechanical layout for a half-bride power module that is optimized for low inductance. In one embodiment, a first power module and a second power module are mounted on each side of a heat sink. An inductance cancelling bus bar is wrapped around the heat sink, the first power module and the second power module in a loop. |
申请公布号 |
US8897014(B2) |
申请公布日期 |
2014.11.25 |
申请号 |
US201213602452 |
申请日期 |
2012.09.04 |
申请人 |
General Electric Company |
发明人 |
Wagoner Robert Gregory;Ritter Allen Michael;Shepard Mark Eugene |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
Hoffman Warnick LLC |
代理人 |
Cusick Ernest G.;Hoffman Warnick LLC |
主权项 |
1. A half-bridge power module, comprising:
a heat sink; a first power module mounted on one side of the heat sink; a second power module mounted on another side of the heat sink opposite the side that the first power module mounts thereto; and an inductance cancelling bus bar wrapped around the heat sink, the first power module and the second power module in a loop. |
地址 |
Schenectady NY US |