发明名称 Mechanical layout for half-bridge power module that is optimized for low inductance
摘要 Disclosed is a mechanical layout for a half-bride power module that is optimized for low inductance. In one embodiment, a first power module and a second power module are mounted on each side of a heat sink. An inductance cancelling bus bar is wrapped around the heat sink, the first power module and the second power module in a loop.
申请公布号 US8897014(B2) 申请公布日期 2014.11.25
申请号 US201213602452 申请日期 2012.09.04
申请人 General Electric Company 发明人 Wagoner Robert Gregory;Ritter Allen Michael;Shepard Mark Eugene
分类号 H05K7/20 主分类号 H05K7/20
代理机构 Hoffman Warnick LLC 代理人 Cusick Ernest G.;Hoffman Warnick LLC
主权项 1. A half-bridge power module, comprising: a heat sink; a first power module mounted on one side of the heat sink; a second power module mounted on another side of the heat sink opposite the side that the first power module mounts thereto; and an inductance cancelling bus bar wrapped around the heat sink, the first power module and the second power module in a loop.
地址 Schenectady NY US