Paste thermal interface materials

摘要

Embodiments of the present disclosure describe techniques and configurations for paste thermal interface materials (TIMs) and their use in integrated circuit (IC) packages. In some embodiments, an IC package includes an IC component, a heat spreader, and a paste TIM disposed between the die and the heat spreader. The paste TIM may include particles of a metal material distributed through a matrix material, and may have a bond line thickness, after curing, of between approximately 20 microns and approximately 100 microns. Other embodiments may be described and/or claimed.

主权项

1. A method of fabricating an integrated circuit (IC) package, the method comprising:
dispensing a paste thermal interface material (TIM) on a first surface of an IC component; placing a heat spreader on the paste TIM; compressing the paste TIM between the heat spreader and the IC component; and curing the paste TIM; wherein:
the paste TIM comprises particles of a metal material distributed through a matrix material and having a bond line thickness, after curing, of between approximately 20 microns and approximately 100 microns; orthe paste TIM comprises particles of a first material having a thermal conductivity greater than approximately 80 watts/Kelvin-meter, particles of a metal material; and a flux material, and a melting temperature of the paste TIM is between approximately 100 degrees Celsius and approximately 300 degrees Celsius.