发明名称 |
Polyamide resin composition and molded product |
摘要 |
Disclosed is an m-xylene group-containing polyamide resin composition having excellent gas barrier properties and heat aging resistance, which contains (A) a polyamide composed of a diamine unit containing 30% by mole or more of an m-xylylenediamine unit and a dicarboxylic acid unit and (B) an aromatic secondary amine based compound and has an oxygen permeability coefficient of not more than 1 cc·mm/m2·day·atm at 23° C. and 75% RH. |
申请公布号 |
US8895122(B2) |
申请公布日期 |
2014.11.25 |
申请号 |
US201013376737 |
申请日期 |
2010.06.09 |
申请人 |
Mitsubishi Gas Chemical Company, Inc. |
发明人 |
Mitadera Jun;Kurokawa Masashi |
分类号 |
B32B1/08;C08K5/18;C08G69/26;F16L9/127;F16L11/06;C08L77/06;F16L11/04 |
主分类号 |
B32B1/08 |
代理机构 |
Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P. |
代理人 |
Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P. |
主权项 |
1. A polyamide resin composition, comprising
(A) a polyamide comprising a diamine unit, comprising 30% by mole or more of an m-xylylenediamine unit, and a dicarboxylic acid unit, (B) an aromatic, secondary-amine-based compound, and (C) an organic, sulfur-based compound wherein a content ratio of the aromatic, secondary-amine-based compound (B) and the organic, sulfur-based compound (C) ((B)/(C) mass ratio) in the polyamide resin composition is from 0.1 to 5.0, wherein the organic sulfur based compound (C) is present in an amount of from 0.2 to 5 parts by mass based on 100 parts by mass of the polyamide (A), and wherein a 100 μm-thick film consisting of the polyamide resin composition has an oxygen permeability coefficient of not more than 1 cc·mm/ 2day·atm at 23 ° C. and 75 % RH, and has a tensile strength retention rate (%) of not less than 92% as calculated according to the following expression (1): Tensile strength retention rate (%) =[{Stress at break (MPa) of film after heat treatment}/{Stress at break (MPa) of film before heat treatment}]×100 (1) where the stress at break (MPa) in this expression is tested in conformity with JIS K7127 by using the film before and after heat treatment at 130° C. for 72 hours. |
地址 |
Tokyo JP |