| 摘要 |
<p>The present invention relates to a metal seed layer leveler containing allyl alcohol and a seed layer using the same. A method of forming a seed layer according to the present invention can form a seed layer having low roughness by adding a leveler containing allyl alcohol when metallic nanoparticles are adsorbed on high specific resistance substrate, and then an electroplating process is performed, thereby fabricating a micro pattern and solving the coating problem of different floor heights as well.</p> |
