发明名称 CONDUCTIVE PASTE AND DIE BONDING METHOD
摘要 Provided are: a conductive paste in which sinterability of silver particles the conductive paste can be easily controlled by using silver particles having predetermined crystal transformation characteristics defined by an XRD analysis, and after a sintering treatment, excellent electrical conductivity and thermal conductivity can be stably obtained; and a die bonding method using the conductive paste. Disclosed is a conductive paste which includes silver particles having a volume average particle size of 0.1 to 30 µm as a sinterable conductive material, and a dispersing medium for making a paste-like form, and in which when the integrated intensity of the peak at 2¸ = 38° ± 0.2° in the X-ray diffraction chart obtainable by an XRD analysis before a sintering treatment of the silver particles is designated as S1, and the integrated intensity of the peak at 2¸ = 38° ± 0.2° in the X-ray diffraction chart obtainable by an XRD analysis after a sintering treatment (250°C, 60 minutes) of the silver particles is designated as S2, the value of S2/S1 is adjusted to a value within the range of 0.2 to 0.8.
申请公布号 KR20140134303(A) 申请公布日期 2014.11.21
申请号 KR20147026856 申请日期 2013.08.20
申请人 KAKEN TECH CO., LTD. 发明人 HORI SHIGEO;FURUI HIROHIKO;FUJITA AKIRA
分类号 H01B1/22;H01B1/00;H01L21/52 主分类号 H01B1/22
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