LIQUID COMPOSITION, COPPER METAL FILM, CONDUCTIVE WIRING LINE, AND METHOD FOR PRODUCING COPPER METAL FILM

摘要

Provided is a copper metal film which has less voids and good electrical conductivity, while exhibiting good adhesion to a base. A liquid composition which contains (a) at least one substance that is selected from the group consisting of formic acid and copper formate, (b) copper oxide particles and (c) a solvent.