发明名称 POLYAMIDE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition which is excellent in dimension stability during water absorption, stability of mechanical characteristics, and slidability and which does not cause plasticization failure during molding, and to provide a molding product formed of the composition.SOLUTION: Provided is the polyamide resin composition including 0.1-20 mass parts of an acrylic modified polyorganosiloxane (B) with respect to 100 mass parts of a polyamide resin (A) including C6-C13 per one amide group in a repeating unit.
申请公布号 JP2014218574(A) 申请公布日期 2014.11.20
申请号 JP20130098237 申请日期 2013.05.08
申请人 KURARAY CO LTD 发明人 TAKEDA HIDEAKI;MUNESAWA YUJI;SUZUKI HIDEAKI;KANGORI TOMOFUMI
分类号 C08L77/00;C08G69/26;C08K7/02;C08L83/07 主分类号 C08L77/00
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