| 摘要 |
<p>An electrical connection apparatus for electrically connecting semiconductor devices for a test to a high-fix board may comprise: a contact plate which is divided into at least two in the same space to pressurize the semiconductor devices respectively by dividing the semiconductor devices to be disposed in the same space for the test; and a contact cylinder which is respectively connected to the contact plate to provide pressure capable of pressurizing the semiconductor devices to each of the contact plate in order to electrically connect the semiconductor devices to the high-fix board.</p> |
