发明名称 |
SUBSTRATE SURFACE TREATMENT METHOD AND DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a treatment method and a treatment device of substrate surface using a line-type particle beam source in which sputter particles scattering by surface treatment for one substrate do not affect the other substrate.SOLUTION: A substrate surface treatment method includes to perform beam irradiation for the surface of one substrate by using a line type particle beam source arranged between two substrates facing each other, and to prevent adhesion of a substance released from one substrate to the other substrate during beam irradiation by using a shielding member arranged between two substrates. |
申请公布号 |
JP2014220415(A) |
申请公布日期 |
2014.11.20 |
申请号 |
JP20130099380 |
申请日期 |
2013.05.09 |
申请人 |
SUGA TADATOMO;BONDTECH INC |
发明人 |
SUGA TADATOMO;YAMAUCHI AKIRA |
分类号 |
H01L21/02;B23K20/00;B23K20/24;C23C14/46;H01L21/304 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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