发明名称 SUBSTRATE SURFACE TREATMENT METHOD AND DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a treatment method and a treatment device of substrate surface using a line-type particle beam source in which sputter particles scattering by surface treatment for one substrate do not affect the other substrate.SOLUTION: A substrate surface treatment method includes to perform beam irradiation for the surface of one substrate by using a line type particle beam source arranged between two substrates facing each other, and to prevent adhesion of a substance released from one substrate to the other substrate during beam irradiation by using a shielding member arranged between two substrates.
申请公布号 JP2014220415(A) 申请公布日期 2014.11.20
申请号 JP20130099380 申请日期 2013.05.09
申请人 SUGA TADATOMO;BONDTECH INC 发明人 SUGA TADATOMO;YAMAUCHI AKIRA
分类号 H01L21/02;B23K20/00;B23K20/24;C23C14/46;H01L21/304 主分类号 H01L21/02
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