| 摘要 |
The present invention involves an epoxy resin composition which includes an epoxy resin, an epoxy resin curing agent, and a granular inorganic filler, wherein the epoxy resin is a cresol novolac type epoxy resin with a weight average molecular weight of 700 to 1800, and the epoxy resin curing agent is a phenol resin with a weight average molecular weight of 700 to 1400. Thus, an epoxy resin curing agent that is inexpensive, has excellent formability, heat resistance, mechanical strength and shock resistance, and that has an appropriate thermal expansion coefficient, can be provided. |
