BENDABLE HEAT READIATING COMPOSITE AND BACKLIGHT UNIT HAVING THE SAME

摘要

A heat-transfer apparatus for dissipating heat from an electronic device is disclosed. The heat-transfer apparatus includes a composite, comprising a metal layer, a dielectric layer and one or more electrically conductive layers. The composite is plastically deformed and is substantially free of crack. A backlight apparatus comprising the heat-transfer apparatus is also provided.

主权项

1. A heat-transfer apparatus, comprising:
a composite, including:
a metal layer;a dielectric layer located on the metal layer; andone or more electrically conductive layers located on the dielectric layer on an opposite side from the metal layer; wherein the composite is a plastically deformed composite such that a surface of the composite at a first leg has a first planar area that is at an angle of between a value of about 70 degrees and a value that is less than about 180 degrees, or greater than a value of about 180 degrees to less than a value of about 360 degrees to a second planar area of a second leg.