| 摘要 |
<p>The invention provides a thermosetting resin composition, a dry film and a PCB used as solder resists and having excellent covering power and characteristics suitable for laser processing. The thermosetting resin composition comprises an epoxy resin (A), a colorant (B) and a curing agent (C), the colorant (B) possesses an absorbance peak within one or two of the 350-550 nm wavelength range and the 570-700 nm wavelength range, and has absorption at the laser oscillation wavelength position used for laser processing.</p> |
