发明名称 SEALING RESIN COMPOSITION AND METHOD FOR PRODUCING THE SAME, AND RESIN SEALING TYPE SEMICONDUCTOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a sealing resin composition which has good storage stability, and also good characteristics of a cured product and good moldability.SOLUTION: The sealing resin composition comprises (A) an epoxy resin, (B) a phenol resin curing agent, (C) a curing accelerator, and (D) inorganic filler, as essential components. The (C) curing accelerator is a coated curing accelerator including a core particle formed of a curing accelerator which is a solid at ordinary temperature and has an average particle diameter of 0.5 to 50μm, and a shell particle which is provided so as to cover a surface of the core particle and comprises inorganic fine particles each having an average particle diameter of 1μm or less and having size of 1/4 or less of the average particle diameter of the core particle.</p>
申请公布号 JP2014218594(A) 申请公布日期 2014.11.20
申请号 JP20130099074 申请日期 2013.05.09
申请人 KYOCERA CHEMICAL CORP 发明人 MASUDA HIROSHI;KUROKAWA TOKUO;UCHIDA TAKESHI;TANAKA FUMIKI;NAKAI ATSUSHI;WATANABE SUSUMU
分类号 C08G59/62;H01L23/29;H01L23/31 主分类号 C08G59/62
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