RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

According to the present invention, a resin composition having superior workability is provided. The paste-like resin composition of the present invention adheres a semiconductor element and a base material, and contains (A) a thermosetting resin and (B) metal particles. d95 in the volume-based particle size distribution of the metal particles as determined with a flow-type particle image analyzer is 10 μm or less. In other words, the volume ratio of metal particles having a particle diameter that exceeds 10 μm is less than 5%. Here, d95 indicates the particle diameter at which the cumulative volume ratio thereof is 95%.

主权项

1. A paste-like resin composition that adheres a semiconductor element and a base material, comprising:
a thermosetting resin, and a metal particle; wherein, d95 in the volume-based particle size distribution of the metal particle as determined with a flow-type particle image analyzer is 10 μm or less.