BGA TEST SOCKET

摘要

For testing a high density BGA package, a central pressure block is designed to press against the chip of the package during test in a test socket. High density socket probe causes high pressure against the package, especially the area under the chip. With the central pressure block of the present invention, the high density BGA package is prevented from deformation because the central pressure block pressing downward against the chip, which balances the pressure coming upward from the high density socket probes under the circuit board in the area under the chip.

主权项

1. A BGA test socket, comprising:
a peripheral pressure unit, further comprising:a central recess;a rectangular wall surrounding the central recess;an upper flat, extending outward from a top of the wall;a lower flat; extending inward from a bottom of the wall; anda window, enclosed by the lower flat;
a central pressure block, further comprising:an upper block, configured to fit in the central recess; anda lower block, protruded downward from the upper block; configured to fit in the window.