发明名称 BREAK DEVICE AND BREAK METHOD
摘要 <p>PROBLEM TO BE SOLVED: To prevent a functional area from fragmenting when the functional area is parted from a brittle material substrate along a scribe line for contour.SOLUTION: A scribe line 51 for contour is formed on a surface of a brittle material substrate 17, and auxiliary scribe lines 52a-52d are formed outside the scribe line for contour. For parting, an underlay sheet 53 is inserted up to a position where the underlay sheet 53 is close to one auxiliary scribe line and the scribe line 51 for contour, and then moved in parallel with the surface of the brittle material substrate 17 to leave the auxiliary scribe line while pressing a periphery on a side where the sheet 53 is not inserted across the auxiliary scribe line 52a. Consequently, a product substrate can be parted from the brittle material substrate 17 without any damage.</p>
申请公布号 JP2014217983(A) 申请公布日期 2014.11.20
申请号 JP20130097374 申请日期 2013.05.07
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 TOMINAGA KEISUKE
分类号 B28D1/22 主分类号 B28D1/22
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