SEMICONDUCTOR DEVICE

摘要

A semiconductor device includes: a substrate; a lower wiring on the substrate; an inter-layer insulating film covering the lower wiring; first and second upper wirings on the inter-layer insulating film and separated from each other; and a semi-insulating protective film covering the first and second upper wirings, wherein the protective film is not provided in a region right above the lower wiring and between the first upper wiring and the second upper wiring.

主权项

1. A semiconductor device comprising:
a substrate; first and second lower wirings on the substrate; an inter-layer insulating film covering the first and second lower wirings; first and second upper wirings on the inter-layer insulating film and separated from each other; a trench wiring on the substrate below a region between the first upper wiring and the second upper wiring and connecting the first lower wiring and the second lower wiring; and a semi-insulating protective film covering the first and second upper wirings.