发明名称 CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a ceramic electronic component having an attachment structure of a metal terminal and a chip component which achieves high reliability and is easily manufactured.SOLUTION: A ceramic electronic component includes: a chip component including a first terminal electrode and a second terminal electrode and has a substantially rectangular parallelepiped shape; a first metal terminal part including a first flat plate part facing a first end surface, a first fitting arm part which sandwiches the chip component to hold the chip component, and a first mounting part; and a second metal terminal part including a second flat plate part facing a second end surface, a second fitting arm part which sandwiches the chip component to hold the chip component, and a second mounting part. Multiple first inner protruding parts are formed on a first arm inner surface in the first fitting arm part. At least a part of the multiple first inner protruding parts engages with the first terminal electrode. Multiple second inner protruding parts are formed on a second arm inner surface in the second fitting arm part. At least a part of the multiple second inner protruding parts engages with the second terminal electrode.
申请公布号 JP2014220470(A) 申请公布日期 2014.11.20
申请号 JP20130100626 申请日期 2013.05.10
申请人 TDK CORP 发明人 MASUDA ATSUSHI;KOBAYASHI KAZUMI;KOMATSU TAKASHI;KUSANO KAYO;HASEBE KAZUYUKI
分类号 H01G4/228;H01G4/232;H01G4/248;H01G4/30;H01G4/38 主分类号 H01G4/228
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