发明名称 MULTILAYER SUBSTRATE AND ELECTRONIC DEVICE USING THE SAME, METHOD OF MANUFACTURING ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent a surface pattern from being covered with a mold resin.SOLUTION: A type tread portion 64 having a frame-like surface layer conductor 64a formed between a land 61 and a surface pattern 63 while surrounding the land 61 and being insulated from the land 61 and the surface pattern 63, and a protective film 110 covering the surface layer conductor 64a, is formed on one side 30a of a build-up layer 30. The height of the protective film 110 in the type tread portion 64 from the one side 30a of a build-up layer 30 is set equal to or higher than the height of the protective film 110 from the one side 30a of a build-up layer 30 at a portion covering the surface pattern 63.
申请公布号 JP2014220305(A) 申请公布日期 2014.11.20
申请号 JP20130097227 申请日期 2013.05.06
申请人 DENSO CORP 发明人 NAKAMURA TOSHIHIRO;TATSUMI MASAHIDE;YABUTA EIJI
分类号 H05K1/02;H05K3/28;H05K3/46 主分类号 H05K1/02
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