SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURE

摘要

A structure and method to improve saw singulation quality and wettability of integrated circuit packages (140) assembled with lead frames (112) having half-etched recesses (134) in leads. A method of manufacturing lead frames includes providing a lead frame strip (110) having a plurality of lead frames. Each of the lead frames includes a depression (130) that is at least partially filled with a material (400) prior to singulating the lead frame strip.

主权项

1. A lead frame strip including a plurality of lead frames, comprising:
at least one elongated depression in a bottom surface of the lead frame strip, the at least one depression sized such that it does not cause an opening to occur between the bottom surface and a top surface of the lead frame strip, wherein the at least one elongated depression extends from a lead of a first lead frame to a lead of a second lead frame adjacent to the first lead frame and includes a portion of the lead frame strip between said lead frames; and a material other than a solder wettable material disposed in the at least one elongated depression, wherein the at least one elongated depression becomes, after singulation of the lead frame strip into individual lead frames, a recess at a corner of an end of a lead of at least one of the first lead frame and the second lead frame.